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Products > Thermal conductive filled alumina
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  • 05導(dǎo)熱填充氧化鋁.jpg

Thermal conductive filled alumina

HuBer │ Martinswerk Martin alumina based fillers are customized for high fill blending development. The grain morphology, particle size distribution, and surface modification of particle surfaces are key to improving the dispersibility of fillers and the processing performance of blends. The nano content of all specifications is very low, which can prevent unnecessary chemical/rheological interactions